Layers |
6 layers |
Board thickness |
1.6MM |
Material |
Shengyi S1000-2 FR-4(TG≥170℃) |
Copper thickness |
1oz(35um) |
Surface Finish |
ENIG Au Thickness 0.8um; Ni Thickness 3um |
Min Hole(mm) |
0.13mm |
Min Line Width(mm) |
0.15mm |
Min Line Space(mm) |
0.15mm |
Solder Mask |
Green |
Legend Color |
White |
Board size |
110*87mm |
PCB assembly |
Mixed surface mount assembly on both sides |
ROHS complied |
Lead FREE assembly process |
Minimum components size |
0201 |
Total components |
677 per board |
IC packge |
BGA,QFN |
Main IC |
Freescale,Texas Instruments, On Semiconductor, Farichild,NXP |
Test |
AOI, X-ray, Functional Test |
Application |
Consumer electronics |