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6 layer ENIG pcb

Product Detail
Layers 6 layers
Board thickness 1.60MM
Material FR4 tg170
Copper thickness 1/1/1/1/1/1 OZ(35um)
Surface Finish ENIG  Au Thickness 0.15um; Ni Thickness 3um
Min Hole(mm) 0.15mm
Min Line Width(mm) 0.15mm
Min Line Space(mm) 0.15mm
Solder Mask Blue
 Legend Color White
Mechanical processing V-scoring, CNC Milling(routing)
Packing Anti-static bag
E-test Flying probe or Fixture
Acceptance standard IPC-A-600H Class 2
Application Automotive electronics
Product Material As a supplier of various PCB technologies, volumes, lead time options, we have a selection of standard materials with which a large bandwidth of the variety of types of PCB can be covered and which are always available in house. Requirements for other or for special materials can also be met in most cases, but, depending upon the exact requirements, up to about 10 working days may be needed to procure the material. Do get in touch with us and discuss your needs with one of our sales or CAM team. Standard materials held in stock:

Components

Thickness Tolerance

Weave type

Internal layers

0,05mm +/-10%

106

Internal layers

0.10mm +/-10%

2116

Internal layers

0,13mm +/-10%

1504

Internal layers

0,15mm +/-10%

1501

Internal layers

0.20mm +/-10%

7628

Internal layers

0,25mm +/-10%

2 x 1504

Internal layers

0.30mm +/-10%

2 x 1501

Internal layers

0.36mm +/-10%

2 x 7628

Internal layers

0,41mm +/-10%

2 x 7628

Internal layers

0,51mm +/-10%

3 x 7628/2116

Internal layers

0,61mm +/-10%

3 x 7628

Internal layers

0.71mm +/-10%

4 x 7628

Internal layers

0,80mm +/-10%

4 x 7628/1080

Internal layers

1,0mm +/-10%

5 x7628/2116

Internal layers

1,2mm +/-10%

6 x7628/2116

Internal layers

1,55mm +/-10%

8 x7628

Prepregs

0.058mm* Depends on layout

106

Prepregs

0.084mm* Depends on layout

1080

Prepregs

0.112mm* Depends on layout

2116

Prepregs

0.205mm* Depends on layout

7628

Cu thickness for internal layers: Standard - 18µm and 35 µm, on request 70 µm, 105µm and 140µm Material type: FR4 Tg: approx. 150°C, 170°C, 180°C εr at 1 MHz: ≤5,4 (typical: 4,7) More available on request Stackup The main 6 layer stackup configuration will be generally as below: ·Top ·Inner ·Ground ·Power ·Inner ·Bottom