Industril sensor 4 layer rigid&flex pcb with 2oz copper

Layers	4 layers rigid+2 layers flex
Board thickness	1.60MM+0.2mm
Material	FR4 tg150+Polymide
Copper thickness	1 OZ(35um)
Surface Finish	ENIG  Au Thickness 1um; Ni Thickness 3um
Min Hole(mm)	0.21mm
Min Line Width(mm)	0.15mm
Min Line Space(mm)	0.15mm
Solder Mask	Green
Legend Color	White
Mechanical processing	V-scoring, CNC Milling(routing)
Packing	Anti-static bag
E-test	Flying probe or Fixture
Acceptance standard	IPC-A-600H Class 2
Application	Automotive electronics

  Introduction Rigid&flex pcbs are combined with stiff boards to create this hybrid product. Some layers ofthe manufacturing process include a flexible circuit that runs through the rigid boards, resembling a standard hardboard circuit design. The board designer will add plated through holes (PTHs) that link stiff and flexible circuits as part of this process. This PCB was popular due to its intelligence, accuracy, and flexibility. Rigid-Flex PCBs simplify the electronic design by removing flexible cables, connections, and individual wiring. A Rigid&Flex boards circuitry is more tightly integrated into the board’s overall structure, which improves electrical performance. Engineers can expect significantly better maintainability and electrical performance thanks to the rigid-flex PCB's internal electrical and mechanical connections.   Material Substrate Materials The most popular rigid-ex substance is woven fiberglass. A thick layer of epoxy resin coats this fiberglass. Nevertheless, epoxy-impregnated fiberglass is uncertain. It can not withstand abrupt and sustained shocks. Polyimide This material is chosen for its flexibility. It is solid and can withstand shocks and motions. Polyimide can also withstand heat. This makes it ideal for applications with temperature fluctuations. Polyester (PET) PET is favored for its electrical characteristics and flexibility. It resists chemicals and dampness. It may thus be employed in harsh industrial conditions. Using a suitable substrate ensures desired strength and longevity. It considers elements like temperature resistance and dimension stability while selecting a substrate. Polyimide Adhesives The temperature elasticity of this adhesive makes it ideal for the job. It can withstand 500°C. Its high heat resistance makes it suitable for a variety of critical applications. Polyester Adhesives These adhesives are more cost saving than polyimide adhesives. They are great for making basic rigid explosion proof circuits. Their relationship is also weak. Polyester adhesives are also not heat resistant. They have been updated recently. This provides them with heat resistance. This change also promotes adaptation. This makes them safe in multilayer PCB assembly. Acrylic Adhesives These adhesives are superior. They have excellent thermal stability against corrosion and chemicals. They are easy to apply and relatively inexpensive. Combined with their availability, they are popular among manufacturers. manufacturers. Epoxies This is probably the most widely used adhesive in rigid-flex circuit manufacturing. They can also withstand corrosion and high and low temperatures. They are also extremely adaptable and adhesively stable. It has a little polyester in it which makes it more flexible.   Stack-up The stack-up of rigid-ex PCB is one of the most parts during rigid-ex PCB fabrication and it’s more complicated than standard rigid boards, let’s have a look at 4 layers of rigid-ex PCB as below: Top solder mask Top layer Dielectric 1 Signal layer 1 Dielectric 3 Signal layer 2 Dielectric 2 Bottom layer Bottom soldermask   PCB Capacity

Rigid board capacity
Number of layers:	1-42 layers
Material:	FR4\high TG FR4\Lead free material\CEM1\CEM3\Aluminum\Metal core\PTFE\Rogers
Out layer Cu thickness:	1-6OZ
Inner layer Cu thickness:	1-4OZ
Maximum processing area:	610*1100mm
Minimum board thickness:	2 layers 0.3mm (12mil) 4 layers 0.4mm (16mil)6 layers 0.8mm (32mil) 8 layers 1.0mm (40mil) 10 layers 1.1mm (44mil) 12 layers 1.3mm (52mil) 14 layers 1.5mm (59mil) 16 layers 1.6mm (63mil)
Minimum Width:	0.076mm (3mil)
Minimum Space:	0.076mm (3mil)
Minimum hole size (final hole):	0.2mm
Aspect ratio:	10:1
Drilling hole size:	0.2-0.65mm
Drilling tolerance:	+\-0.05mm(2mil)
PTH tolerance:	Φ0.2-1.6mm +\-0.075mm (3mil) Φ1.6-6.3mm+\-0.1mm(4mil)
NPTH tolerance:	Φ0.2-1.6mm +\-0.05mm(2mil) Φ1.6-6.3mm+\-0.05mm(2mil)
Finish board tolerance:	Thickness＜0.8mm, Tolerance:+/-0.08mm
	0.8mm≤Thickness≤6.5mm,Tolerance+/-10%
Minimum soldermask bridge:	0.076mm (3mil)
Twisting and bending:	≤0.75% Min0.5%
Raneg of TG:	130-215℃
Impedance tolerance:	+/-10%，Min+/-5%
Surface Treatment:	HASL, LF HASL
	Immersion Gold, Flash Gold,Gold finger
	Immersion Silver, Immersion Tin,OSP
	Selective Gold Plating, Gold thickness up to 3um(120u”)
	Carbon Print, Peelable S/M,ENEPIG
Aluminum board capacity
Number of layers:	Single layer, double layers
Maximum board size:	1500*600mm
Board thickness:	0.5-3.0mm
Copper thickness:	0.5-4oz
Minimum hole size:	0.8mm
Minimum width:	0.1mm
Minimum space:	0.12mm
Minimum pad size:	10 micron
Surface finish:	HASL,OSP,ENIG
Shaping:	CNC, Punching, V-cut
Equipement:	Universal Tester
	Flying Probe Open/Short Tester
	High power Microscope
	Solderability Testing Kit
	Peel Strength tester
	High Volt Open & Short tester
	Cross Section Molding Kit With Polisher
FPC Capacity
Layers:	1-8 layers
Board thickness:	0.05-0.5mm
Copper thickness:	0.5-3OZ
Minimum Width:	0.075mm
Minimum space:	0.075mm
In through hole size:	0.2mm
Minimum laser hole size:	0.075mm
Minimum punching hole size:	0.5mm
Soldermask tolerance:	+\-0.5mm
Minimum routing dimension tolerance:	+\-0.5mm
Surface finish:	HASL,LF HASL, Immersion Silver, Immersion Gold,Flash Gold, OSP
Shaping:	Punching, Laser, Cut
Equipement:	Universal Tester
	Flying Probe Open/Short Tester
	High power Microscope
	Solderability Testing Kit
	Peel Strength tester
	High Volt Open & Short tester
	Cross Section Molding Kit With Polisher
Rigid&flex capacity
Layers:	1-28 layers
Material type:	FR-4(High Tg, Halogen Free, High Frequency) PTFE, BT, Getek, Aluminium base，Copper base，KB, Nanya, Shengyi, ITEQ, ILM, Isola, Nelco, Rogers, Arlon
Board thickness:	6-240mil/0.15-6.0mm
Copper thickness:	210um (6oz) for inner layer 210um (6oz) for outer layer
Min mechanical drill size:	0.2mm/0.08”
Aspect ratio:	2:1
Max panel size:	Sigle side or double sides:500mm*1200mm
	Multilayer layers:508mm X 610mm (20″ X 24″)
Min line width/space:	0.076mm / 0.076mm (0.003″ / 0.003″)/ 3mil/3mil
Via hole type:	Blind / Buried / Plugged(VOP,VIP…)
HDI / Microvia:	YES
Surface finish:	HASL, LF HASL
	Immersion Gold, Flash Gold,Gold finger
	Immersion Silver, Immersion Tin,OSP
	Selective Gold Plating, Gold thickness up to 3um(120u”)
	Carbon Print, Peelable S/M,ENEPIG
Shaping:	CNC, Punching, V-cut
Equipement:	Universal Tester
	Flying Probe Open/Short Tester
	High power Microscope
	Solderability Testing Kit
	Peel Strength tester
	High Volt Open & Short tester
	Cross Section Molding Kit With Polisher