Layers | 2 layers flex |
Board thickness | 0.16mm |
Material | Polymide SYSF305 |
Copper thickness | 1 OZ(35um) |
Surface Finish | ENIG Au Thickness 1um; Ni Thickness 3um |
Min Hole(mm) | 0.23mm |
Min Line Width(mm) | 0.15mm |
Min Line Space(mm) | 0.15mm |
Solder Mask | No soldermask |
Legend Color | No silkscreen |
Mechanical processing | V-scoring, CNC Milling(routing) |
Packing | Anti-static bag |
E-test | Flying probe or Fixture |
Acceptance standard | IPC-A-600H Class 2 |
Application | Automotive electronics |